Cup Function
※ 100~ 300mm wafer Application. (One size application only)
※ Basic wafer Thickness : 500~1,800um.
※ Cup Material: PVC /PP
※ Rotation Speed : Up to 800 rpm ± 1 rpm.
※ 2-Chemical Spray Arm per cup.
※ Chemical Temperature RT-60℃
※ DI Spray Rinse.
※ N2 Spray Function (Anti-Static Function & Hot N2 ).
※ Flow rate & Pressure setting by recipe (DI / HOT DI / N2).
※ Process Chemical Drain.
※ Wafer On-site Sensor.
※ CCD Monitor System
